Asia Pacific Field Programmable Gate Array (FPGA) Maketi Lautele e Faʻateleina sili atu 13% CAGR i le 2026

E tusa ai ma le Sailiga Suʻesuʻega o le tuputupu aʻe o le lipoti o le tuputupu aʻe ua faʻaulutalaina "Asia Pacific Field Programmable Gate Array (FPGA) Market Market, By Process Technology (<28 nm, 28 nm - 90 nm,> 90 nm), By Architecture (SRAM, Flash, Anti -Fuse), E ala i le faʻatulagaina (Low-range FPGA, Mid-range FPGA, High-range FPGA), E ala i le Talosaga (Consumer Electronics, Automotive, Alamanuia, Fesoʻotaʻiga & Faʻamaumauga Nofoaga, Aerospace & Puipuiga, Telecom), Alamanuia Suʻesuʻe Lipoti, Regional Outlook (Saina, Initia, Iapani, Ausetalia, Korea i Saute), Faʻatuputeleina Gafatia, Faʻatauvaga Maketi Faʻasoa ma Valoaga, 2020 - 2026 "O le lapoʻa e tusa ma le USD 5.5 piliona i le 2026.

O le tuputupu aʻe o maketi a Asia Pasefika FPGA e mafua mai ile faʻateleina ole faʻatinoina ole Initaneti o Mea (IoT) tekonolosi i malo malo, faletupe, ma pisinisi ile itulagi. FPGA ofa atu le tele o penefiti i IoT apalai pei o fetuʻutuʻunaʻi e faʻapitoa uma masini & polokalama, malosi puipuia, ma faʻamautinoa taimi i maketi. Mo se faʻataʻitaʻiga, na faʻalauiloa e le Malo o Initia le polokalame o le 'Smart City Mission' mo le atinaʻeina o atinaʻe tetele i totonu o le taulaga e faʻaaoga ai AI & IoT. O ia atinaʻe taumafaiga e ono faʻateleina le vaetamaina o masini komepiuta faʻaaogaina, lagolagoina le tuputupu aʻe maketi i tausaga a sau.

O le <28nm gaioiga tekonolosi vaega ua fuafuaina e tupu i le CAGR o sili atu 14% i le Asia Pasefika FPGA maketi. O le tuputupu aʻe e mafua mai i le tumau o le faaleleia ma atinaʻe i le tisaini ma le tekonolosi o le FPGA e faʻaleleia ai le tagata faʻatau poto masani. FPGA gaosi kamupani aofia ai Xilinx, Intel Corporation, ma Microchip Tekonolosi, faʻatasi ai ma isi o loʻo maua pea suiga i tekinolosi faʻagasologa i le <28nm vaega ma faʻatasi ai ma le fou tekonolosi 7nm manuia faʻatauina i le maketi.

O le vaega maualalo FPGA faʻatulagaina vaega o loʻo faʻaalia ai se taua tuputupu ae avanoa i le maketi, tuputupu aʻe i le CAGR o 13% i le taimi o le talaʻaga timeline. O le vaega tuputupu aʻe e mafua mai i le faʻateleina manaʻoga mo maualalo paoa taumafaina masini e pei o feaveaʻi masini eletise, uaealesi masini, taʻavale, ma pito masini masini. O le maualalo maualalo FPGA faʻatulagaina ofaina tele foliga e aofia ai le faʻaititia o le lavelave i le malamala, maualalo mafauʻau density, ma maualuga-paoa lelei.

O le tagata faʻaaoga eletise eletise vaega o loʻo fuafuaina e tupu i le CAGR o 11% i le vaitau o vaitau. FPGA fofo o loʻo faʻaaogaina i le tele o tagata faʻaaoga eletise oloa e aofia ai meapuʻe uila, telefoni poto, taʻaloga faʻamafanafana, ma TV poto, ma isi. Kamupani o loʻo taulaʻi atu i le faʻatinoina o AI tekonolosi i tagata faʻaaoga eletise masini e tuʻuina ai oloa eseesega ia latou taulaga ma faʻateleina a latou manaʻoga i le maketi. Mo se faʻataʻitaʻiga, ia Iuni 2020, na galulue faʻatasi ai le Intel Corporation ma Udacity, Inc. e faʻalauiloa fofo a le AI-optimized FPGA mo pito AI masini e pei o telefoni poto, tapeleti, ma isi.

O le au taaalo i le maketi Asia Pasefika FPGA o loʻo taulaʻi atu i le faʻaauauina o le R&D gaioiga ma vaʻai i le atinaʻeina o oloa & fou o se auala lelei mo le faʻalauteleina maketi. Mo se faʻataʻitaʻiga, ia Novema 2019, na faalauiloa e le GOWIN Semiconductor Corporation mSoC FPGAs ma le leitio Bluetooth 5.0 Low Energy leitio, o loʻo ofaina ai le mafaia ona faʻaaogaina o metotia faʻavae i luga o le fausaga FPGA. O nisi o au taua i le maketi o AGM Micro, Gowin Semiconductor Corp., Shenzhen Pango Microsystems, Taiwan Semiconductor Manufacturing Company (TSMC), ma Xian Intelligence Silicon Tech, ma isi.

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